Die Bonding and Vacuum Packaging System

PROCUREMENT OVERVIEW

The Department of Defense, specifically the Naval Research Laboratory (NRL), is seeking proposals for a Die Bonding and Vacuum Packaging System. This procurement aims to fulfill the need for advanced manufacturing capabilities that support the development and production of electronic components used in defense applications. The core objective is to enhance the reliability and performance of these components through improved bonding and packaging techniques.

ISSUING ORGANIZATION

The issuing organization is the Department of Defense, specifically the Department of the Navy, Office of Naval Research (ONR), Naval Research Laboratory (NRL). The location is Washington, DC, USA. The primary contact for this opportunity is Kevin Nguyen, who can be reached via email at [email protected].

KEY DATES

• Posted Date: August 3, 2026
• Proposal Due Date: August 7, 2026
• Anticipated Award Date: Not specified
• Performance Period: Not specified

CONTRACT DETAILS

The contract type is not explicitly mentioned in the provided information. There is no estimated contract value or budget range indicated, nor are there any option years specified.

MANDATORY REQUIREMENTS

Bidders must meet the following mandatory requirements to be considered eligible:

• Certifications and Registrations: Registration in SAM.gov is required.
• Security Clearances: No specific security clearance requirements are mentioned.
• Set-Aside Restrictions: There are no set-aside restrictions noted.
• Geographic Restrictions: No geographic restrictions or place-of-performance requirements are specified.
• Experience Requirements: Minimum years of experience or past performance requirements are not detailed.
• Bonding or Insurance Requirements: No bonding or insurance requirements are mentioned.

TECHNICAL CAPABILITIES

Bidders must possess specific technical skills related to die bonding and vacuum packaging technologies. Familiarity with industry standards and methodologies relevant to electronic component manufacturing is essential, although specific tools or platforms are not detailed in the provided information.

DELIVERABLES AND PERFORMANCE STANDARDS

Key deliverables, milestones, reporting requirements, and performance metrics or service-level agreements are not explicitly outlined in the available documentation.

EVALUATION CRITERIA

The evaluation criteria for proposals have not been specified in the provided information. There is no mention of the weighting or priority of evaluation factors, nor whether the selection process will be based on best-value or lowest-price technically acceptable criteria.

PREFERRED QUALIFICATIONS

While not mandatory, bidders with the following qualifications may have a competitive advantage:

• Preferred Certifications: Any additional certifications relevant to die bonding and vacuum packaging technologies.
• Experience Types: Previous experience in defense-related projects or similar manufacturing processes may be viewed favorably.
• Capabilities: Advanced technological capabilities or innovative approaches in the field of electronic component manufacturing.

This summary provides a comprehensive overview of the opportunity for potential bidders to assess their fit and readiness to respond to the RFP.